LED lighting thermal analysis, reliability and innovative design discussion - (AddTime ： 2013-01-19)

Components and system reliability is heat dissipation and semiconductor lighting two important issues in Austria industrial town, Lin at the EuroSimE2011 international academic during the meeting, the international experts around these two issues, the academic report and the exchange, solutions such as how to use such as carbon nanotubes cooling? How to use the simulation accurate prediction and w replacement bulb and 3 w 200W led Flood light array cooling situation? How to break through the limitations of the 200W led Flood light chip on the lamps and lanterns of the reliability of the system simulation and so on the question. On the meeting, 2 European large, multinational semiconductor lighting research project SE2A (auto electronic components development, automobile SSL head lamp) and CSSL (alternative type ball steep light), the project manager of the two projects, management methods and the general situation of the progress report.

Semiconductor lighting thermal analysis and innovative design

About semiconductor lighting of thermal analysis and thermal design, among them, from Hong Kong university of science and technology, zhang kai introduced how to use piezoelectric material made of active cooling system and carbon nanotubes for thermal interface materials to solve high brightness 200W led floodlights of heat dissipation problems. Use active cooling system is the biggest advantage of its cooling efficiency. The study found that using active cooling system can reduce the temperature as high as 37 ℃. Using piezoelectric material made of active cooling system is the biggest advantage of it has no mechanical parts, therefore, less mechanical parts wear will increase active cooling system of the life and reliability.

Delft university YeHuaiYu released its project about semiconductor lighting thermal analysis and how to through the more effective design to solve the heat dissipation problem results. Take and zhang kai different cooling ways, he mainly USES the passive cooling system in order to reduce the cost of lighting system. He advocated through the optimization design of 200W led Flood light cooling channel to solve the problem of the node temperature, including to design the structure of the lighting system to increase the cooling effect.

The Czech institute of technology Jiri Jakovenko spoke about semiconductor lighting 8 w replacement bulb thermal simulation and experimental validation. Based on the replacement bulb 200W led Flood light packaging, drive electronics, heat dissipation mechanism, light conversion mechanism, secondary optical institutions, are simulated, and to prove the experiment and simulation error only ten percent. He thinks, the simulation technology can accurately predict the temperature section.

From guilin university of electronic science and technology of Fengze Hou for 3 w 200W led Flood light array system cooling fins of the thermal performance analysis so that can more accurately predict the temperature of the semiconductor lighting lamps and lanterns. Delft university of Sima Tarashioon the experimental method, semiconductor lighting driver electronic components in the high temperature performance decline phenomenon, such as 110 ℃ temperature, a ceramic capacitor (nominal using temperature 125 ℃) has made the whole integrated circuit efficiency dropped by 2% ~ 3%. A driver circuit is comprised of several ceramic capacitor and inductor of. Under high temperature, drive circuit of the actual efficiency will be greatly different from the design efficiency.

The reliability problem outstanding view or consensus

About semiconductor lighting reliability analysis results. Philips lighting WillemVan Driel summarizes the lighting industry in a few in the semiconductor lighting system reliability prediction is an important research. Due to the semiconductor lighting system is made of lamps and lanterns, power supply, communication and control subsystem consists of large complicated system, WillemVan Driel think semiconductor lighting industry should jump out only consider 200W led Flood light chip life thinking, and to further consider overall system reliability.

According to the system reliability, he describes two latest system reliability simulation technology MonteCarlo method, and the BBN + Marckov Chain method. He laid special stress on because of the rapid development of semiconductor lighting, the new structure, new concept of lamps and lanterns/system will lead to the old failure mechanism and mode was no longer, the new failure mode and accelerated aging test method research is very important. Delft university Sau Koh discusses how can accurately predict epoxy resin in the temperature and voltage change of the life of the model, this model can describe the environment more real lamps and lanterns. Therefore, it can more accurately predict life. For instance, a in 25 ℃ uniformly greenhouse outside lighting life than in the winter and summer environment outside lighting short life more. In addition, from the British royal Greenwich university C. Bailey tells how to use the existing multidisciplinary simulation technology to predict used in special environment of LCD screen 200W led Flood light back light design method. They also consider: hot, user visual effect and reliability design parameters of the interaction and seek for the optimization design.

At present, the eu's large semiconductor lighting research project "SE2A" and "CSSL", SE2A development high reliability of car electronic components, systems, including SSL head lamp and its drive electronics development, the project running time is about 3 years, a total of 21 companies, research institutes and universities to participate in the general budget, more than 21 million euros. CSSL focusing on SSL alternative ball steep light development and commercialization, including 200W led Flood light chip and package, drive electronics, optics and heat dissipation mechanism, etc., the project running time is about 3 years, master budget for 27 million euros. EuroSimE is the annual international academic conference, focusing on microelectronics and micro system thermal, mechanical, and multiscale physical simulation and experimental methods. Since 2000, has held 12 sessions. And access to all over the world to participate in a lot of sound and height, and at the same time by IEEE - CPMT (international electronic and electrical engineer association components manufacturing and packaging branch) support. From this year, the Austrian forest industrial university, Bosch, Philips, Siemens, TNO (Netherlands applied science research organization), the Dutch delft university, university of Maryland, China guilin university of electronic technology, Hong Kong university of science and technology and other countries and regions, and scholars Infineon, NXP, Ansys and other large international enterprise representative, deepened the academic study and widely used cooperation.